ProtoDAC TDA1387 X8 project

[hifinet]

I bend, solder then clip. Then examine all joints with a loupe. Not sure if that is the proper technique. If the solder flows through the plated hole to the top side, I think the chance of failure is very low. One thing to be aware of is to apply much more heat to the pads that connect to the ground plane, due to the heat sink effect. Those are pin 5 of the module, the two ground leads of the I/V resistors and the ground leads of the RCA jacks. Also, GPIO header pins 6 and 14.